WAFER SHEET COOLERS
Specifications
Used for stress-free cooling of flat and hollow wafer sheets at ambient temperature after baking and before spreading or conditioning
Also used for the vertical transport of wafer sheets or books within a wafer production line
Modular design of anodized aluminum cast elements
Transport height of basic version 0.3 m, height freely variable by extension elements
20 wafer sheet or wafer book frames/m
Stainless steel wire frames