WAFER SHEET COOLERS


 

Specifications

Used for stress-free cooling of flat and hollow wafer sheets at ambient temperature after baking and before spreading or conditioning

Also used for the vertical transport of wafer sheets or books within a wafer production line

Modular design of anodized aluminum cast elements

Transport height of basic version 0.3 m, height freely variable by extension elements

20 wafer sheet or wafer book frames/m

Stainless steel wire frames