WAFER BOOK CUTTERS


 

WAFER BOOK CUTTERS

Specification

            • Cut the wafer books discharged from the wafer book cooler to smaller wafer fingers in the desired size
  • Up to 28 cuts/min are possible
    Fully automatic operation
    Cutting of single or of several stacked wafer books possible
    Different product sizes possible by exchangeable cutting frames with cutting wires or cutting blades (depending on application)
    Tandem or twin cutter versions allow higher capacities and simultaneous production of wafer fingers in two different sizes
    Combination with evacuator and shredder allows automatic recycling of wafer waste for wafer cream production