Cut the wafer books discharged from the wafer book cooler to smaller wafer fingers in the desired size

Up to 28 cuts/min are possible

Fully automatic operation

Cutting of single or of several stacked wafer books possible

Different product sizes possible by exchangeable cutting frames with cutting wires or cutting blades (depending on application)

Tandem or twin cutter versions allow higher capacities and simultaneous production of wafer fingers in two different sizes

Combination with evacuator and shredder allows automatic recycling of wafer waste for wafer cream production